Process
In terms of production capacity, we currently have 5 SMT lines, with a daily total production capacity of up to 10 million points.
We currently have 2 DIP production lines, with a daily total production capacity of approximately 3,200, and an assembly line that can achieve a daily total production capacity of about 600 units for finished product packaging
| Production Capacity(Board Level & System Level) | ||
|---|---|---|
| Process | Lines | Capacity/Day |
| SMT | 5 | 10 million chips |
| DIP | 3 | 3200 PCS(300*300mm) |
| Ass’y | 3 | 600 PCS(1U server) |
We have a total of 5 Panasonic series surface mount machines (Mounters), equipped with 1 BTU model and 4 HELLER models for Panasonic printers and Reflow, respectively. All 5 lines are configured with On-Line AOI, capable of producing components as small as SIZE-01005 and supporting POP processes.
Continuous nitrogen supply for production, and 100% A.O.I. inspection for all products.
The DIP production line primarily uses lead-free wave soldering furnaces, and the current board size for DIP can reach up to 500mm
For the DIP process, we have 4 different types of depaneling machines to meet the requirements for various design split-board needs. Additionally, we offer options for dispensing machines and ICT (In-Circuit Test) based on customer preferences.
We have one assembly line that is 60 meters long, two testing and packaging lines that are 36 meters long each, and an additional module testing line. The assembly line is equipped with hot press machines, ultrasonic bonding machines, vibration testers, clean benches, and both offline and online barcode printers.
We currently have 2 Burn-In (B/I) rooms, capable of temperature control ranging from room temperature to 65℃. Each socket is equipped with independent timing functionality.