Business Items

BOARDS ASSEMBLY.OEM (INCLUDS.ICT.ATE.AOI.X-RAY.TEST)

FPC(0.3~0.5 mm)
PCB(0.6mm~0.8mm)
PCB(1.0mm~1.4mm)
PCB(1.6mm~2.5mm)
  • Card swiping machines/Vehicle electronics and navigation/Medical and health care equipment/Pet related products/Consumer electronics

SMT & DIP LEAD FREE HALOGEN FREE PROCESS

  • Passed the lead-free process certification from SONY EMCS Corporation in May 2003
  • The entire SMT line and DIP line in the factory have fully adopted lead-free processes.
  • Introduction of POP Process
  • Implementation of Shop Floor System
  • Implementation of Four Major Control Systems: Solder Paste, Steel Plate Tension, First-In-First-Out for Components, and Material Baking Specifications
  • Possesses the optimal PCB layout design capability with process-specific recommendations

NEW PRODUCT TRIAL RUN EVALUATION &DESIGN EASY MANUFACTURING FEEDBACK

  • Feedback and Suggestions for PCB Layout Improvement
  • Feedback and Suggestions for PCB Layout Improvement
  • Suggestions for the Production of Fixtures for Finished Product Assembly
  • Trial Production Report Available